We propose a novel method of fabricating flexible single-crystalline semiconductor materials and devices in order to address technical challenges in next-generation electronics and photonics with significantly improved performance characteristics, functionalities, and scalabilities, while reducing manufacturing cost In this invention disclosure, we describe on hybrid flexible templates employing single-crystalline semiconductor thin-film layer to serve as a high-quality crystalline-defect-free flexible platform for high-performance semiconductor device structures with a focus on manufacturing processes of the hybrid flexible templates. In particular, we claim that a combination of (1) freestanding high-quality semiconductor thin-film layer on a mask grown by lateral epitaxial overgrowth, (2) semiconductor layer transfer to flexible template, and (3) semiconductor substrate separation can be achieved to construct the hybrid flexible templates. The new design and fabrication processes are expected to provide a new technological platform that can overcome the limitations in crystallinedefect- bearing materials of currently developed flexible devices with compromised performance characteristics and the limitations in high-quality semiconductor devices on single-crystalline substrates with rigid and fragile mechanical properties and high manufacturing cost.