The composite structure of second-generation (2G) high-temperature superconducting (HTS) tape is prone to issues such as debonding between individual layers and delamination within the superconductor layer. More specifically, the interface between the LaMn03 (LMO) top buffer layer and I the REBa2Cu30x (REBCO, RE= rare earth) superconducting film has been found to be prone to debonding i.e. adhesive failure and the REBCO film itself has been observed to be prone to delamination i.e. cohesive failure. Inhomogeneities in the superconductor film microstructure provide crack propagation paths that may result in reduced transverse tensile strength. Additionally, evidence of weak transverse strength in tapes in coils fabricated with epoxy impregnation has been observed. The problem of delamination is even more problematic in multifilamentary 2G HTS tapes where material between superconducting filaments is removed. This invention is on the development of a thin film 2G HTS tape with superior resistance to delamination.